Printed Circuit Boards

Print version All images

• single-sided, double-sided, multi-layer PCBs of the 3,4,5 accuracy class according to GOST 23751-86;
• strip - line PCBs with TH metallization.

• flexible printed cables;
• strip contacts of copper-bearing alloys 0,05-0,2mm thick;
• screen stencils for surface mounting.

1. Maximum number of layers in multi-layer boards – 24.
2. Maximal PCB’s overall dimensions - 420x380mm.
3. Minimal nominal width of a printed conductor – 0,12mm (is preset, while designing a PCB).
4. Minimal nominal diameter of a contact pad – 0,5mm (is preset, while designing a PCB).
5. Minimal nominal diameter of a hole – 0,2mm, when PCB’s thickness is up to 1,0mm (tolerance for a hole diameter according to GOST 23751-86).
6. Minimal spacing between printed pattern elements – 0,12mm (is preset, while designing a PCB).
7. Limit deviation of a printed conductor width, of a contact pad is according to GOST 23751-80.
   • 3 class - +/- 0,1mm;
   • 4 class - +/- 0,05mm;
   • 5 class - +/- 0,03mm;
8. Covering O-C (tin-lead) (61) 12 reflow soldered, GOR POS (61), N6 (nickel), Zl-Co (gold-cobalt) (99, 97) 0,25mm.
9. Covering of end contacts (lamels): N6, N6 Zl-Co (99, 97) 0,5; N-B6 (brome), N-B6 Zl-Co (99, 97).
10. Marking by a screen-printing method (on one side or both sides) with CT3 19.1 home paint, Coates X581 German paint.
11. Protective film solder mask DYNA MASK KM-30 by the Mortor company.
12. Liquid solder mask H85 by the TAIYO company.
13. Materials used:
    • glass-fiber laminates: SF, STF, FR-4;
    • dielectric materials: FAF-4D, FLAN, ROGERS;
    • glass-fiber cloth: STP-4-0,062, PREPREG by the ISOLA company.
14. Material thickness – 0,1-2,5mm.
15. Foil thickness – 18, 35microns.
16. PCB’s outline tooling:
    • milling, die forming/punching.